Wednesday, June 26, 2013

BUSBAR SIZE FACTOR

Busbar sizing is done to check withstand ability of
        Thermal Stress
        Mechanical Stress
        Deflection

Thermal Stress:
          Flow of current causes thermal stress.
          Temperature rise is checked for
        Normal load current
        Fault current.
Note: Sizing based on governing criteria
          Steady state temperature depends on
        Radiation heat loss
        Convective heat loss
        Solar heat gain by the conductor

Mechanical Stress
          Mechanical stress on the busbar material is due to
Dynamic force
        Electrodynamic force during short circuit condition
        Wind force
Static force
        Static conductor tension
        Self weight
          Adequacy of busbar material is decided when it’s bending stress / tensile stress are within the limiting value.

Deflection
          Deflection of busbar happens
At Dynamic condition
        Due to combination of electromagnetic force & Wind force
At Static condition
        Due to self weight and sag
          Check for deflection in case of rigid busbar is mechanical property which decides the limiting value

          In case of strung busbar it is minimum electrical clearance decides the limiting value.

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Chitika