Busbar sizing is done to check withstand ability
of
–
Thermal Stress
–
Mechanical Stress
– Deflection
Thermal Stress:
•
Flow of current causes thermal stress.
•
Temperature rise is checked for
–
Normal load current
–
Fault current.
Note: Sizing based on governing criteria
•
Steady state temperature depends on
–
Radiation heat loss
–
Convective heat loss
–
Solar heat gain by the conductor
Mechanical Stress
•
Mechanical stress on the busbar material is
due to
Dynamic force
–
Electrodynamic force during short circuit
condition
–
Wind force
Static force
–
Static conductor tension
–
Self weight
•
Adequacy of busbar material is decided when
it’s bending stress / tensile stress are within the limiting value.
Deflection
•
Deflection of busbar happens
At Dynamic condition
–
Due to combination of electromagnetic force
& Wind force
At Static condition
–
Due to self weight and sag
•
Check for deflection in case of rigid busbar
is mechanical property which decides the limiting value
•
In case of strung busbar it is minimum
electrical clearance decides the limiting value.
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